Sputter deposition apparatus and method
AssigneeDyson Technology Limited
InventorsMichael Edward Rendall, Robert Ian Joseph Gruar
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Abstract
Certain examples described herein relate to a sputter deposition apparatus including a guiding member to guide a substrate in a conveyance direction, a plasma source to generate a plasma, and a magnet arrangement. The magnet arrangement is configured to confine the plasma within the apparatus to a pre-treatment zone, within which the substrate is exposed to the plasma in use. The magnet arrangement is also configured to confine the plasma within the apparatus to a sputter deposition zone, located after the pre-treatment zone in the conveyance direction, to provide for sputter deposition of a target material to the substrate in use. The pre-treatment and sputter deposition zones are disposed about the guiding member.
Claims22
A sputter deposition apparatus comprising:
- a guiding member to guide a substrate in a conveyance direction, wherein the guiding member is a curved member having a curved surface, wherein the curved member comprises a roller having a circumference;
- a plasma source to generate a plasma;
- a magnet arrangement configured to confine the plasma within the apparatus to:
- a pre-treatment zone, within which the substrate is exposed to the plasma in use;
- and
- a sputter deposition zone, located after the pre-treatment zone in the conveyance direction, to provide for sputter deposition of a target material to the substrate in use;
- wherein the pre-treatment and sputter deposition zones are separated about and disposed about the guiding member, and
- wherein the magnet arrangement is configured to provide the plasma such that the plasma substantially conforms to a curvature of at least ¼ of the circumference of the roller.
Dependencies are inferred from the claim text.