Printed circuit board and optoelectronic module providing different chip orientation
AssigneeLeica Geosystems AG
InventorsRalph Harti, Stefan Kohlgrüber, Andrey Marinov, Michele Portentoso
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Abstract
A printed circuit board (PCB) having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, whereby the side landing pad comprises at least two landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in at least two different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, and an optoelectronic module based on such a printed circuit board and an according time of flight camera.
Claims21
A printed circuit board having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, wherein the side landing pad comprises a number N>1 of landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in N different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, wherein the landing areas are connected to each other and have one common electric connection.
A printed circuit board having a lateral extent and comprising a side landing pad for direct bonding of an optoelectronic chip, wherein the side landing pad comprises a number N>1 of landing areas being differently oriented with regard to the lateral, thus enabling a bonding of the chip in N different lateral orientations relative to the printed circuit board, whereby the electrical connection lengths of the landing areas are equal, wherein the landing areas are separated and each landing area is contacted by a separate electric connection.
Dependencies are inferred from the claim text.