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US 12,381,107 B2Granted
Protective tapes, articles therefrom, and methods of making and using same
Assignee3M Innovative Properties Company
InventorsShujun J. Wang, Robin E. Gorrell, Roger A. Grisle, Richard Y. Liu, Yaoyao Chen
Life of this patent
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Abstract
An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent.
Claims18
An article comprising:
- a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface;
- and
- a protective tape borne on the circuit forming surface, the protective tape comprising:
- a support layer;
- and
- a curable adhesive layer borne on a major surface of the support layer, the curable adhesive layer comprising a rubber elastomer and a thermal curing agent, and a cured intermediate layer that is disposed between the curable adhesive layer and the support layer, wherein the cured intermediate layer is the reaction product of a curable intermediate layer comprising an elastomer, a multifunctional crosslinker, and a process oil, and wherein the cured intermediate layer has an elastic storage modulus (G′) that:
- (i) decreases with increasing temperature in the range of 25° C. to 250° C.;
- (ii) is between 0.0001 MPa and 0.7 MPa in the range of 25° C. to 250° C.;
- (iii) has a minimum value that occurs at 250° C.;
- and (iv) is greater than 0.0001 MPa at 250° C.;
- (v) at 250° C., is less than it is at 50° C.
8 more elements
Dependencies are inferred from the claim text.