Wafer optical processing device and sintering furnace

A sintering furnace, comprising:

• a wafer sintering processing device;
• and
• a wafer optical processing device for optically processing a sintered wafer, the wafer optical processing device being disposed downstream of said wafer sintering processing device, and the wafer optical processing device comprising:
• a wafer support device, said wafer support device comprising a support piece, said support piece being provided with an upper surface and a lower surface that are disposed facing each other, said support piece being hollowed out in a direction from the upper surface to the lower surface, said support piece being configured to be capable of supporting said wafer above said upper surface;
• an upper light source device, said upper light source device comprising a light source plate that is integrated with a plurality of light source modules, said upper light source device being disposed above said wafer support device and configured to provide a light source that illuminates the upper surface of said support piece;
• and
• a lower light source device, said lower light source device comprising a plurality of separate detachable light source modules, said lower light source device being disposed below said wafer support device and configured to provide a light source that illuminates the lower surface of said support piece.