Package structure having grating coupler and manufacturing method thereof

A package structure, comprising:

• a first photonic die including a first grating material layer with a first grating coupler configured to receive and transmit a light beam;
• a second photonic die, disposed beside and adjacent to the first photonic die and including a second grating material layer with a second grating coupler configured to transmit and emit the light beam;
• a first electronic die disposed over the first photonic die, wherein the first electronic die includes a first lens;
• a second electronic die disposed over the second photonic die, wherein the second electronic die includes a second lens;
• and
• an interposer structure, disposed below the first and second photonic dies and including a third grating material layer with a third grating coupler configured to waveguide the light beam,
• wherein the first and second photonic dies are optically coupled through the light beam waveguided between the first, third, and second grating couplers.

A manufacturing method of a package structure, comprising:

• providing a first photonic die including a first grating material layer with a first grating coupler, and a first electronic die including a first lens disposed over and bonded with the first photonic die;
• providing a second photonic die including a second grating material layer with a second grating coupler, and a second electronic die including a second lens disposed over and bonded with the second photonic die;
• providing an interposer structure including a third grating material layer with a third grating coupler;
• and
• connecting the first photonic die and the first electronic die, and the second photonic die and the second electronic die to the interposer structure,
• wherein the first and second photonic dies are optically coupled through the third grating coupler of the interposer structure and the first and second grating couplers.