Cured product of resin composition, laminate, and resin composition
AssigneeNippon Sheet Glass Co., Ltd.
InventorsKoichiro Nakamura, Yuji Hiranuma
Life of this patent
Estimating the term…
Abstract
A cured product of a resin composition according to the present invention includes at least silsesquioxane. When the average thermal expansion coefficient of the cured product at 30 to 200° C. is expressed as α1 [K−1], at least one of requirements α1/α2≥10 and (α1−α2)2×108≥0.4 is satisfied, where a reference value α2 is 350×10−6 [K−1] or less. In the cured product, an absorbance derived from a siloxane bond, an absorbance derived from a hydrocarbon group, and an absorbance derived from a hydroxy group are respectively expressed as Ia, Ib, and Ic, the absorbances being determined by attenuated total reflection using a Fourier transform infrared spectrophotometer. In this case, requirements 0.09≤Ia/Ib≤3.0 and 0.04≤Ic/Ib≤1.0 are satisfied.
Claims9
A laminate comprising:
- a substrate;
- and
- a cured product including a silsesquioxane, the cured product being provided on the substrate,
- wherein the substrate has an average thermal expansion coefficient αs of 350×10−6 or less [K−1] at 30 to 200° C., the cured product has an average thermal expansion coefficient α1 [K−1] at 30 to 200° C., and αs and α1 satisfy at least one selected from the group consisting of α1/αs≥10 and (α1−αs)2×108≥0.4
- the cured product has an infrared absorption spectrum, the absorbance spectrum includes an absorbance Ia derived from a siloxane bond in which two silicon atoms are bonded to one oxygen atom, an absorbance Ib derived from a hydrocarbon group, an absorbance Ic derived from a hydroxyl group, and an absorbance Id derived from an oxetanyl group, and
- 0.09≤Ia/Ib≤3.0, 0.04≤Ic/Ib≤1.0, and Ia/Id≥45 are satisfied.
Dependencies are inferred from the claim text.