Resin composition, film, composite material, moving body, and three-dimensional printing material
AssigneeMitsubishi Chemical Corporation
InventorsMasayasu Hasuike, Nao Yamasue
Life of this patent
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Abstract
A resin composition with high heat resistance, melt formability, and secondary processability is provided. A resin composition containing: a poly(aryl ether ketone) resin (A); and a poly(ether imide sulfone) resin (B), wherein the poly(aryl ether ketone) resin (A) and the poly(ether imide sulfone) resin (B) are compatibly mixed. The poly(aryl ether ketone) resin (A) is preferably a poly(ether ketone ketone) resin with a repeating unit (a-1) represented by the following formula (1A) and a repeating unit (a-2) represented by the following formula (2A), and the resin composition has one glass transition temperature.
Claims24
A resin composition comprising:
- a poly(aryl ether ketone) resin (A);
- and a poly(ether imide sulfone) resin (B), wherein the poly(aryl ether ketone) resin (A) and the poly(ether imide sulfone) resin (B) are compatibly mixed.
Dependencies are inferred from the claim text.