Substrate processing apparatus and substrate processing method

A substrate processing apparatus, comprising:

• a rotary table configured to move each of multiple substrate chucks to, in sequence, a carry-in position where a carry-in of a substrate is performed, a processing position where thinning of the substrate is performed, and a carry-out position where a carry-out of the substrate is performed;
• two connectors, connecting the substrate chuck and the rotary table, configured to linearly move to adjust a tilt angle of the substrate chuck with respect to the rotary table at the processing position;
• a spindle shaft including a flange at an end thereof, wherein a whetstone is attached to the flange in a replaceable manner, and the whetstone is configured to thin the substrate at the processing position;
• a laser displacement sensor provided at the carry-out position and configured to measure, at multiple points of the substrate in a diametrical direction thereof, a plate thickness of the substrate thinned by the whetstone;
• and
• a controller and a storage including a program, wherein the storage and the program are configured, with the controller, to control the substrate processing apparatus,
• wherein the controller is configured to:
• control the laser displacement sensor to measure the plate thickness of the substrate, which has been thinned by the whetstone, at the carry-out position;
• after measuring the plate thickness of the substrate and before thinning another substrate, control the two connectors to adjust the substrate chuck that holds said another substrate based on a plate thickness measurement result of the substrate;
• and
• control the spindle shaft to thin said another substrate while said another substrate is held by the substrate chuck tilted at the adjusted angle.