Polishing head and polishing apparatus

Abstract

The disclosed subject matter relates to a polishing head for pressing a polishing tool against a substrate, such as a wafer. Further, the disclosed subject matter relates to a polishing apparatus for polishing a substrate with such a polishing head. A polishing head includes an annular elastic member configured to press a polishing tool against the substrate, and a pressing-tool body having a pressing surface configured to press the polishing tool against the substrate via the elastic member, wherein the pressing surface has a first fitting groove in which a first portion of the elastic member fits, the first portion (41) protrudes from the pressing surface, the elastic member is put on the pressing-tool body (43) with the elastic member elastically deformed, and the polishing head is configured to press the polishing tool against the substrate by the first portion.

Dependencies are inferred from the claim text.