Substrate processing apparatus and control method of substrate processing apparatus

A control method of a substrate processing apparatus,

• wherein the substrate processing apparatus comprises:
• multiple processing units each configured to process a substrate by using a chemical;
• an exhaust path through which a gas exhausted from the multiple processing units flows;
• and
• a gas processing apparatus provided in the exhaust path to remove a target component contained in the gas flowing through the exhaust path from the gas, and
• wherein the gas processing apparatus comprises:
• a duct having therein a flow path through which the gas passes;
• at least one partition plate configured to divide the flow path into multiple spaces, and formed of a porous material, through which the gas passes, configured to retain a liquid;
• and
• at least one liquid supply configured to supply a dissolving liquid configured to dissolve the target component contained in the gas to each of the at least one partition plate, and
• wherein the control method of the substrate processing apparatus comprises adjusting a flow rate of the dissolving liquid supplied to the at least one partition plate from the at least one liquid supply according to operation information indicating an operational status of the multiple processing units, and
• the operation information is recipe information including a number of the processing units to be operated for a time period.