Manufacturing method of electronic device

A manufacturing method of an electronic device, comprising:

• providing a first substrate and a second substrate;
• providing an adhesive member between the first substrate and the second substrate;
• providing a first curved element and a second curved element opposite to the first curved element, wherein the first curved element has a curved bottom surface facing the second curved element, the second curved element has a curved top surface facing the first curved element, the curved bottom surface of the first curved element is a convex surface, and the curved top surface of the second curved element is a concave surface;
• arranging the second substrate on the curved top surface of the second curved element;
• arranging the first substrate between the first curved element and the second substrate;
• and
• pressurizing the first curved element and the second curved element, so that the first substrate and the second substrate are attached to each other through the adhesive member, thereby forming a curved composite component,
• wherein the first substrate has a flat surface before the step of pressurizing the first curved element and the second curved element, and the flat surface of the first substrate becomes curved after the step of pressurizing the first curved element and the second curved element.