Thin-film devices and fabrication
AssigneeView Operating Corporation
InventorsAbhishek Anant Dixit, Todd William Martin, Anshu A. Pradhan, Fabian Strong, Robert T. Rozbicki
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Abstract
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
Claims15
A method of fabricating an electrochromic device comprising a first transparent conductor layer, an electrochromic stack, a second transparent conductor layer, and a vapor barrier layer and/or an encapsulation layer disposed, in order, on a substantially transparent substrate, the vapor barrier layer and/or the encapsulation layer disposed over the second transparent conductor layer, the method comprising:
- punching through the vapor barrier layer and/or the encapsulation layer to form at least one hole down to, or into, the second transparent conductor layer;
- and
- applying a bus bar material through the at least one hole to make electrical contact with the second transparent conductor layer,
- wherein at least a portion of the second transparent conductor layer is disposed between the bus bar material and the substantially transparent substrate.
An electrochromic device comprising:
- a substantially transparent substrate;
- a first transparent conductor layer disposed on the substantially transparent substrate;
- an electrochromic stack disposed on the first transparent conductor layer;
- a second transparent conductor layer disposed on the electrochromic stack;
- a vapor barrier layer and/or an encapsulation layer disposed on the second transparent conductor layer;
- at least one hole through the vapor barrier layer and/or the encapsulation layer down to, or into, the second transparent conductor layer;
- and
- a bus bar material in the at least one hole configured to make electrical contact with the second transparent conductor layer,
- wherein at least a portion of the second transparent conductor layer is disposed between the bus bar material and the substantially transparent substrate.
Dependencies are inferred from the claim text.