Chip-on-array with interposer for a multidimensional transducer array
AssigneeSiemens Medical Solutions USA, Inc.
InventorsBaik Woo Lee, Stephen R. Barnes
Life of this patent
Estimating the term…
Abstract
In a chip-on-array approach, acoustic and electronic modules are separately formed. The acoustic stack is connected to one interposer, and the electronics are connected to another interposer. Different connection processes (e.g., using low temperature bonding for the acoustic stack and higher temperature-based interconnect for the electronics) may be used. This arrangement may allow for different pitches of the transducer elements and the I/O of the electronics by staggering vias in the interposers. The two interposers are then connected to form the chip-on-array.
Claims15
A method for connecting an integrated circuit with transducer stack, the method comprising:
- connecting a first sheet of material with first vias to the transducer stack, the first sheet comprising a first interposer part, the transducer stack comprising a matching layer and a piezoelectric layer, wherein connecting the first sheet to the transducer stack comprises bonding the matching and piezoelectric layers of the transducer stack together and the first sheet at a same time with a polymer curable at a temperature below a Curie temperature of the transducer stack;
- connecting, at a temperature above the Curie temperature of the transducer stack, a second sheet of material with second vias to an integrated circuit for ultrasound transmit and/or receive operation, the second sheet comprising a second interposer part;
- and then
- bonding the first sheet of material as connected to the transducer stack with the second sheet of material as connected to the integrated circuit.
Dependencies are inferred from the claim text.