Circuit module and large-scale circuit system
AssigneeMurata Manufacturing Co., Ltd.
InventorsOsamu Miki, Tatsuya Hosotani
Life of this patent
Estimating the term…
Abstract
A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.
Claims20
A circuit module comprising:
- a circuit module substrate mounted on a large-scale circuit board and having an area smaller than the large-scale circuit board, the large-scale circuit board having a large-scale-circuit-board-side fitting structure part;
- an electronic circuit component mounted on the circuit module substrate;
- a plurality of circuit-module-substrate-side connection terminals at the circuit module substrate;
- and
- a circuit-module-substrate-side fitting structure part at the circuit module substrate, wherein
- the plurality of circuit-module-substrate-side connection terminals include an electric signal terminal configuring an electric signal path, and a high current terminal configuring a high current path of a power system,
- the plurality of circuit-module-substrate-side connection terminals are electrically connected to a plurality of large-scale-circuit-board-side connection terminals at the large-scale circuit board,
- the circuit-module-substrate-side fitting structure part and the large-scale-circuit-board-side fitting structure part are electrically connected and mechanically fixed to each other, and
- a non-conductive thermal adhesive layer is between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surface of the circuit module substrate and the surface of the base material by a non-conductive thermally conductive material.
Dependencies are inferred from the claim text.