Electronic component-equipped resin casing and method for producing same

A method for manufacturing a resin housing having an electronic component, comprising:

• preparing an electronic component mounting film that includes a base film, a circuit pattern layer formed on at least one surface of the base film, and an electronic component being connected to the circuit pattern layer and mounted on the base film;
• setting the electronic component mounting film in a first mold such that a surface of the electronic component mounting film on which the electronic component is mounted faces the first mold and the electronic component fills a pocket of the first mold together with an impact absorbing layer that covers the electronic component and a periphery of the electronic component;
• clamping the first mold and a second mold to form a cavity between the first mold with the electronic component mounting film and the second mold;
• and
• injecting a molten resin into the cavity to mold a housing, and integrating the electronic component mounting film along an inner surface of the housing in a state where the circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.

A method for manufacturing a resin housing having an electronic component, comprising:

• preparing an electronic component mounting film that includes a base film, a circuit pattern layer formed on at least one surface of the base film, and an electronic component being connected to the circuit pattern layer and mounted on the base film;
• placing an impact absorbing layer in a pocket of a first mold, wherein the pocket is for receiving the electronic component mounting film;
• setting the electronic component mounting film in the pocket of the first mold such that a surface on which the electronic component is mounted faces and touches the impact absorbing layer;
• clamping the first mold and a second mold to form a cavity between the first mold with the electronic component mounting film and the second mold;
• and
• injecting a molten resin into the cavity to mold a housing, and integrating the electronic component mounting film along an inner surface of the housing in a state where the circuit pattern layer of the electronic component mounting film is not bent around a portion on which the electronic component is mounted.