Acoustic wave filter with multiple acoustic wave devices on a subtrate

A radio frequency module comprising:

• a package substrate;
• an acoustic wave filter configured to filter a radiofrequency signal and including a first acoustic wave device including a first portion of a piezoelectric layer and a first multi-layer interdigital transducer electrode disposed over the first portion, and a plurality of additional acoustic wave devices coupled to the first acoustic wave device and including a second portion of the piezoelectric layer and a plurality of multi-layer interdigital transducer electrodes disposed over the second portion, at least one of the plurality of multi-layer interdigital transducer electrodes including a metal layer that is thinner than a corresponding metal layer of a same material of the first multi-layer interdigital transducer electrode, the metal layer being a top layer and having a greater density than any other metal layer of the first multi-layer interdigital transducer electrode, and the metal layer being a top layer and having a greater density than any other metal layer of said at least one of the plurality of multi-layer interdigital transducer electrode;
• and
• additional circuitry, the acoustic wave filter and the additional circuitry disposed on the package substrate.