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US 12,368,430 B2Granted
Method of forming acoustic wave device with reduced acoustic coupling
AssigneeSkyworks Solutions, Inc.
InventorsRei Goto, Hironori Fukuhara
Life of this patent
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AssigneeSkyworks Solutions, Inc.
InventorsRei Goto, Hironori Fukuhara
Estimating the term…
A method of forming an acoustic wave device is disclosed. The method can include providing a structure having a support substrate that includes a first substrate portion, a second substrate portion, and a third substrate portion between the first portion and the second portion, a piezoelectric layer that includes a first portion over the first substrate portion and a second portion over the second substrate portion, a first interdigital transducer electrode on the first portion of the piezoelectric layer, and a second interdigital transducer electrode on the second portion of the piezoelectric layer. the method can also include etching at least a portion of the piezoelectric layer such that a region over the third substrate portion is free from the piezoelectric layer.
A method of forming an acoustic wave device comprising:
A method of forming an acoustic wave device comprising:
Dependencies are inferred from the claim text.