Method for ion implantation uniformity control
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTien-Shun Chang, Yu-Kang Liu, Su-Hao Liu, Huicheng Chang, Yee-Chia Yeo
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTien-Shun Chang, Yu-Kang Liu, Su-Hao Liu, Huicheng Chang, Yee-Chia Yeo
Estimating the term…
A method includes moving a plurality of sensors along a translation path with respect to an ion beam, acquiring sensor signals produced by the plurality of sensors, converting the acquired sensor signals into a data set representative of a two-dimensional (2D) profile of the ion beam, generating a plurality of first one-dimensional (1D) profiles of the ion beam from the data set, generating a plurality of second 1D profiles of the ion beam by spatially inverting each of the plurality of first 1D profiles, generating a plurality of third 1D profiles of the ion beam by superposing first current density values of each of the plurality of first 1D profiles with second current density values of a corresponding one of the plurality of second 1D profiles and determining whether to continue an implantation process with the ion beam in accordance with the plurality of third 1D profiles.
A method for ion implantation of a wafer, the method comprising:
A method for ion beam uniformity tuning, the method comprising:
A method comprising:
Dependencies are inferred from the claim text.