Piezoelectric bulk layers with tilted c-axis orientation and methods for making the same
AssigneeQorvo US, Inc.
InventorsDerya Deniz, Matthew Wasilik, Robert Kraft, John Belsick
Life of this patent
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AssigneeQorvo US, Inc.
InventorsDerya Deniz, Matthew Wasilik, Robert Kraft, John Belsick
Estimating the term…
A structure includes a substrate including a wafer or a portion thereof; and a piezoelectric bulk material layer comprising a first portion deposited onto the substrate and a second portion deposited onto the first portion, the second portion comprising an outer surface having a surface roughness (Ra) of 4.5 nm or less. Methods for depositing a piezoelectric bulk material layer include depositing a first portion of bulk layer material at a first incidence angle to achieve a predetermined c-axis tilt, and depositing a second portion of the bulk material layer onto the first portion at a second incidence angle that is smaller than the first incidence angle. The second portion has a second c-axis tilt that substantially aligns with the first c-axis tilt.
A structure comprising:
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Dependencies are inferred from the claim text.