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US 12,365,819 B2Granted
Primer composition for adhesive bonding and method of using the same
AssigneeCytec Industries Inc.
InventorsYiqiang Zhao, Dalip Kohli
Life of this patent
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Abstract
Disclosed herein is a solvent-based bonding primer composition containing one or more organic solvents, one or more epoxy resins, one or more curing agents, a silane compound, and a low amount of core-shell rubber particles in nanometer size, submicron or micron size. Also disclosed is a method of applying the solvent-based bonding primer composition onto a metallic surface of a first substrate prior to bonding the metallic surface to a second substrate via a curable adhesive.
Claims7
A surface treatment for treating a metallic surface prior to adhesive bonding comprising:
- applying a primer composition onto a metallic surface to form a curable primer film having a continuous surface, the primer composition comprising:
- (i) one or more epoxy resins;
- (ii) at least one amine-containing curing agent;
- (iii) a silane compound having at least one hydrolyzable group;
- (iv) core-shell rubber (CSR) particles;
- and
- (v) a mixture of organic solvents comprising methyl ether ketone (MEK) in combination with at least one solvent selected from:
- diacetone alcohol (DAA), acetone, isopropyl alcohol, tetrahydrofuran (THF), ethylene glycol, xylene, toluene, and ethyl acetate,
- wherein the primer composition has a solid content of 5%-30%, and the amount of CSR particles is less than 2 wt. % (weight percent) based on the total weight of the composition,
- wherein water is not added to the primer composition, and
- wherein components (i)-(v) in the primer composition form a homogeneous solution.
8 more elements
Dependencies are inferred from the claim text.