Back to results
US 12,365,758 B2Granted
Encapsulation structure
AssigneeIndustrial Technology Research Institute
InventorsCheng-Yi Lin, Shih-Ming Chen
Life of this patent
Estimating the term…
Abstract
A resin composition is provided, which includes a first polymer and a second polymer. The first polymer is formed by a reaction of an epoxy resin modified with a first elastic molecular segment and an epoxy resin curing agent. The second polymer is formed by a polymerization of an acrylate modified with a second elastic molecular segment.
Claims11
An encapsulation structure, comprising:
- an optoelectronic device;
- and
- an encapsulant film packaging the optoelectronic device, wherein the encapsulant film includes:
- a first polymer formed by a reaction of an epoxy resin modified with a first elastic molecular segment and an epoxy resin curing agent;
- and
- a second polymer formed by polymerization of an acrylate modified with a second elastic molecular segment.
3 more elements
Dependencies are inferred from the claim text.