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US 12,365,585 B2Granted
Method of forming a microstructured surface
AssigneeThe Regents of the University of California
InventorsMuchen Xu, Chang-Jin Kim
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Abstract
A method of forming a microstructured surface includes the operations of depositing electrodes on a surface of a substrate and securing a mold against the surface of the substrate containing the electrodes with a tight contact with the electrodes, the mold containing a plurality of cavities therein. Pressure is applied between the mold and the substrate to force material from the substrate into the plurality of cavities around the electrodes to form a plurality of microfeatures. The mold is separated from the substrate.
Claims13
A method of forming a microstructured surface comprising:
- depositing electrodes on a surface of a substrate;
- securing a mold in tight contact against a surface of the electrodes, the mold containing a plurality of cavities therein and wherein the electrodes do not substantially block the plurality of cavities;
- applying pressure between the mold and the substrate to force material from the substrate around or through the electrodes into the plurality of cavities to form a plurality of microfeatures while the tight contact between the mold and the surface of the electrodes prevents the material from the substrate from covering the electrodes that is in the tight contact with the mold;
- and
- separating the mold from the substrate wherein the surface of the electrodes in tight contact with the mold are exposed in between microfeatures with little or no material from the substrate present.
2 more elements
Dependencies are inferred from the claim text.