Micromechanical component for a sensor or microphone device

A manufacturing method for a micromechanical component for a sensor or microphone device, the method comprising the following steps:

• forming a frame structure on at least one intermediate layer at least partially covering a substrate surface;
• spanning an inner volume, which is at least partially framed by the frame structure, with a diaphragm in such a way that a diaphragm inner side of the diaphragm abuts the inner volume, the inner volume being hermetically sealed in such a way that the diaphragm is warpable by a pressure difference between an internal pressure present at the diaphragm inner side and an external pressure present at a diaphragm outer side of the diaphragm which is directed away from the diaphragm inner side;
• forming a bending beam structure in the inner volume, including at least one anchoring area, which is attached at the frame structure to the substrate surface and/or to the at least one intermediate layer, and including at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.