High-integrity opaque-inset panel envelope, and method for manufacturing the same
AssigneeFiserv, Inc.
InventorsJason Corbitt Gaskey, Hrishikesh Shashikant Karekar, Santosh Kumar, Stephen Orlando Bozzone
Life of this patent
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AssigneeFiserv, Inc.
InventorsJason Corbitt Gaskey, Hrishikesh Shashikant Karekar, Santosh Kumar, Stephen Orlando Bozzone
Estimating the term…
A high-integrity opaque-inset panel envelope includes a front panel formed from a printable material, one or more apertures being defined therethrough, one or more flaps extending from the edges of the front panel, and one or more opaque inset panels/labels disposed on an inner surface of the front panel to cover the one or more apertures. Opaque inset panels can have an optical brightness about 1-6% greater than the optical brightness of the printable material. The envelope can be formed by removing portions of a printable material to form one or more flaps about a front panel and one or more apertures through the front panel and disposing one or more opaque inset panels to an inner surface of the front panel, such that the one or more opaque inset panels covers the one or more apertures.
An envelope construction comprising:
Dependencies are inferred from the claim text.