Multilayer electronic device and method for producing the same
AssigneeFreshape SA
InventorsDmitrii Unuchek, Tonglai Chen, Yuhang Liu, Vanni Cedric Simone Roldi
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Abstract
The present invention concerns an electronic device, preferably a thin film electronic device, and a method for producing the device. The device comprises an intermediate structure (301, 401, 501) at the interface between neighboring unit devices connected in series. The intermediate structure is suitable to employ deposition techniques that make it possible to avoid steps of scribing or patterning insulating and/or separating lines between adjacent layers of the device.
Claims22
A multilayer electronic device comprising a plurality of unit electronic devices, said unit electronic devices being connected in series, wherein said plurality of unit electronic devices comprise at least first and second neighbouring unit electronic devices, wherein the multilayer electronic device comprises a substrate or non-conducting base layer,
- wherein each of said first and second unit devices comprises a lower conductive layer and an upper conductive layer, wherein each of said first and second unit devices comprise at least one electronic layer comprising a material having semiconducting, photovoltaic, photoelectric and/or electroluminescent properties, said electronic layer being provided between said upper and lower conductive layer of the corresponding first and second unit devices,
- wherein the multilayer electronic device comprises an intermediate structure formed by a single, continuous and homogenous material which has continuous electronic properties and provided between said first and second unit electronic devices, wherein:
- a bottom of said intermediate structure is in direct contact with the lower conductive layer of said second unit electronic device,
- said intermediate structure physically separates at least part of the electronic layers of said first and second unit electronic devices, and
- said intermediate structure comprises a conductive material and is provided to electrically connect the upper conductive layer of said first unit electronic device with the lower conductive layer of the said second unit electronic device,
- wherein the lower conductive layers of said first and second unit devices are separated by a gap, and wherein said intermediate structure is tilted, tapered and/or curved towards a side that is opposite to and away from said gap such that said intermediate structure slopes upward and away from said gap and from the lower conductive layer of said first unit electronic device.
A method for producing a multilayer electronic device comprising a plurality of unit electronic devices, said unit electronic devices being connected in series, wherein said plurality of unit electronic devices comprise at least first and second neighboring unit electronic devices, the method comprising:
- providing a substrate comprising a first conductive layer forming first conductive layers of said first and second unit devices, wherein said first conductive layers of said first and second unit devices are electrically separated by a gap;
- depositing an intermediate structure at least partially on the first conductive layer of said second unit device so as to be in direct contact with said first conductive layer, wherein the intermediate structure comprises a conductive material;
- depositing at least one electronic layer comprising a material having semiconducting, photovoltaic, photoelectric and/or electroluminescent properties;
- depositing a second conductive layer, wherein during depositing said second conductive layer said intermediate structure provides a shaded area and/or separation structure such that, during depositing said second conductive layer, second conductive layers of said first and second unit devices are obtained, said second conductive layers being electrically separated by said shaded area and/or separation structure,
- wherein the intermediate structure is provided to electrically connect the second conductive layer of a first unit electronic device with the first conductive layer of a second unit electronic device,
- wherein the intermediate structure is deposited in a single deposition step and is formed by a single, continuous and homogenous material which has continuous electronic properties, and wherein the intermediate structure is deposited so as to be tilted, tapered and/or curved towards a side that is opposite to and away from said gap such that said intermediate structure slopes upward and away from said gap and from the first conductive layer of said first unit electronic device.
Dependencies are inferred from the claim text.