US 12,364,038 B2Granted

Sensor die package

AssigneesSTMicroelectronics S.r.l., Stmicroelectronics Pte Ltd

InventorsDavid Gani, Yiying Kuo

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Abstract

The present disclosure is directed to a package that includes a transparent layer that is on and covers a sensor of a die as well as a plurality of electrical connections that extend from a first surface of the package to the second surface of the package opposite to the first surface. In at least one embodiment of a package, the electrical connections each include a conductive structure that extends through the transparent layer to a first side of a corresponding contact pad of the die, and at least one electrical that extends into the second surface of the die to a second side of the corresponding contact pad that is opposite to the first side. In at least another embodiment of a package, the electrical connections include a conductive structure that extends through a molding compound to a first side of a corresponding contact pad of the die, and at least one electrical via that extends into the second surface of the die to a second side of the corresponding contact pad opposite to the first side.

Claims19

Dependent claims

A device, comprising:

a die including:
a sensor on a first surface of the die;
a first contact pad adjacent to the sensor;
and
a second contact pad spaced further from the sensor than the first contact pad;
a transparent layer on the first surface of the die, the transparent layer having:
an exterior facing surface opposite the first surface of the die;
and
a first sidewall transverse the exterior facing surface;
a molding compound around the die and the transparent layer, the molding compound having an outer surface that is further from the sensor than the exterior facing surface of the transparent layer, the first sidewall of the transparent layer contacting the molding compound;
a non-conductive layer including a plurality of stacked non-conductive layers, the non-conductive layer having:
a second surface coplanar with the molding compound;
a third surface coplanar with the transparent layer;
a fourth surface opposite the second and third surfaces;
a first thickness between the second and fourth surfaces;
and
a second thickness between the third and fourth surfaces, the first thickness is less than the second thickness;
and
a conductive structure extending from the second contact pad through the transparent layer to the non-conductive layer.

16 more elements

A device, comprising:

a die including:
a first surface and a second surface opposite to the first surface;
a plurality of first sidewalls that extend from the first surface to the second surface;
a sensor at the first surface, the sensor having a first dimension that extends in a first direction transverse to the plurality of first sidewalls;
and
a conductive pad at the first surface;
a transparent layer on the first surface, the transparent layer having a second dimension extending in the first direction greater than the first dimension, and the transparent layer having a plurality of second sidewalls;
a molding compound on the plurality of first sidewalls of the die and on the plurality of second sidewalls of the transparent layer;
a non-conductive layer on and coplanar with the molding compound and the transparent layer, the non-conductive layer having a first thickness less than a second thickness, the first thickness being on the molding compound and the second thickness being on the transparent layer;
and
a conductive structure extends into the transparent layer to the conductive pad.

8 more elements

A device, comprising:

a die including:
a first surface and a second surface opposite to the first surface;
a plurality of first sidewalls that extend from the first surface to the second surface;
a contact pad at the first surface of the die;
and
a sensor at the first surface of the die;
a transparent layer on the first surface of the die, the transparent layer includes:
a third surface on the first surface of the die and on the sensor;
a fourth surface opposite the third surface and facing away from die;
and
a plurality of second sidewalls that that extend from the third surface to the fourth surface;
a conductive structure extending into the fourth surface of the transparent layer to the contact pad at the first surface of the die;
a molding compound is on and covers the plurality of first sidewalls and the plurality of second sidewalls;
at least one non-conductive layer stacked on the molding compound and the fourth surface of the transparent layer, the at least one non-conductive layer having a fifth surface opposite the first surface of the die, a first thickness between the fifth surface and the molding compound is less than a second thickness between the fifth surface and the transparent layer;
an insulating layer extends into the second surface to the contact pad of the die;
and
an electrical via extends into the insulating layer to the contact pad and is coupled to the contact pad of the die.

14 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/556,604Filed 20 Dec 2021 · us provisional application
Priority: 29 Dec 2020
Published: US 2022/0208819 A130 Jun 2022
Granted: 15 Jul 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10F 39/804
Constructional details of image sensors: containers or encapsulations
H10F 39/011
Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors…:…
H10F 39/811
Constructional details of image sensors: interconnections
H10F 71/00
Manufacture or treatment of devices covered by this subclass