Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate
AssigneeResonac Corporation
InventorsYoshikatsu Shiraokawa, Shinichi Kamoshida, Hiroshi Kurokawa
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Abstract
Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 μg/dm2; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.
Claims12
A copper-clad laminate comprising an insulating layer containing a resin and silica, and a copper foil arranged on at least one surface of the insulating layer,
- wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc and a second metal that is one or more metals selected from the group consisting of nickel and cobalt,
- a content of zinc in the metal-treated layer is 20 to 500 μg/dm2,
- a ratio of a total content of the second metal/zinc is 1.2 to 5,
- a content of molybdenum in the metal-treated layer is 0 μg/dm2, and
- a total content of second metal in the metal-treated layer is 60 to 500 μg/dm2.
Dependencies are inferred from the claim text.