Film for manufacturing electronic component

A method for manufacturing an electronic component, the method comprising:

• contacting a film and the electronic component;
• and then
• peeling the film from the electronic component,
• wherein the film comprises:
• a polymer layer including a front surface layer, a rear surface layer disposed on the front surface layer, and a silicone release layer disposed on the front surface layer;
• and
• metal nanowires dispersed in the polymer layer, the metal nanowires including a ferromagnetic metal including at least one of nickel (Ni), cobalt (Co), or iron (Fe), or alloys thereof,
• wherein a content of the metal nanowires in the front surface layer is less than 0.2 wt %.

A film for manufacturing an electronic component, comprising:

• a polymer layer including a front surface layer, a rear surface layer disposed on the front surface layer, and a release layer disposed on the front surface layer;
• and
• metal nanowires dispersed in the polymer layer,
• wherein the release layer has an average thickness of 10 nm to 200 nm, and
• wherein a content of the metal nanowires in the front surface layer is less than 0.2 wt %.