Deposition processing systems having active temperature control and associated methods
AssigneeTechnetics Group LLC
InventorsAngus McFadden, Jason Wright
Life of this patent
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Abstract
Several embodiments of the present technology are directed to actively controlling a temperature of a substrate in a chamber during manufacturing of a material or thin film. In some embodiments, the method can include cooling or heating the substrate to have a temperature within a target range, depositing a material over a surface of the substrate, and controlling the temperature of the substrate while the material is being deposited. In some embodiments, controlling the temperature of the substrate can include removing thermal energy from the substrate by directing a fluid over the substrate to maintain the temperature of the substrate within a target range throughout the deposition process.
Claims12
A deposition processing system, comprising
- a chamber;
- a substrate;
- a support coupled to the chamber to support the substrate within the chamber;
- a deposition mechanism to deposit a material onto the substrate;
- at least one of a heater, a cooler, or a combined heater and cooler thermally coupled to the substrate;
- at least a first temperature measurement device to measure a substrate temperature;
- at least a second temperature measurement device to measure a material temperature, wherein the material is the material deposited on the substrate;
- and
- a controller to receive temperature data from at least the first temperature measurement device and the second temperature measurement device to control the temperature of the substrate based on the material temperature using at least one of the heater, the cooler, or the combined heater and cooler.
Dependencies are inferred from the claim text.