Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, and pressure-sensitive adhesive sheet
AssigneeNitto Denko Corporation
InventorsDaisuke Mizuno, Kensuke Tani, Satoshi Honda
Life of this patent
Estimating the term…
Abstract
The present invention relates to a pressure-sensitive adhesive composition including a compound having a substituent represented by the general formula (1) described in the specification, in which when each of R1 and R2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR1 and an oxygen atom of —OR2 is 1.31 Å or more and 4.70 Å or less, a pressure-sensitive adhesive layer formed of the pressure-sensitive adhesive composition, and a pressure-sensitive adhesive sheet comprising the pressure-sensitive adhesive layer.
Claims4
A pressure-sensitive adhesive composition, comprising
- a compound having a substituent represented by the following general formula (1),
- wherein,
- the compound is a polymer containing a structure derived from a (meth) acrylate monomer whose homopolymer has a glass transition temperature of 10° C. or lower, and
- when each of R1 and R2 in the substituent represented by the general formula (1) represents a hydrogen atom, a distance between an oxygen atom of —OR1 and an oxygen atom of —OR2 is 1.31 Å or more and 4.70 Å or less
- (in the general formula (1), L represents a phosphorus atom, or a boron atom;
- and each of R1 and R2 independently represents a hydrogen atom, or an aliphatic hydrocarbon group, an aryl group or a heterocyclic group which may have a substituent).
Dependencies are inferred from the claim text.