Curable resin, curable resin composition, and cured product
AssigneeDIC Corporation
InventorsLichen Yang, Ryuichi Matsuoka, Hiroyoshi Kannari
Life of this patent
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Abstract
Provided is a cured product having excellent heat resistance and dielectric properties (low dielectric properties) by using a curable resin characterized by having an indane skeleton. Specifically, provided are a curable resin having an indane skeleton represented by the following formula, a resin composition containing the same, and a cured product thereof. X is a (meth)acryloyl group; Ra and Rb are each an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12; j is an integer of 1 to 3; k and l are each an integer of 0 to 4; n is an average number of repeating units, being 0.5 to 20; and m is an integer of 0 to 2.
Claims6
A curable resin comprising an indane skeleton represented by General Formula (1) below:
- where in Formula (1) above, X represents a (meth)acryloyl group;
- Ra and Rb are each independently an alkyl group, an aryl group, an aralkyl group, or a cycloalkyl group with a carbon atom number of 1 to 12;
- j indicates an integer of 1 to 3;
- k and l each independently indicate an integer of 0 to 4;
- n is an average number of repeating units, indicating a value of 0.5 to 20;
- m indicates an integer of 0 to 2;
- and a straight line from Ra, X, and a carbon atom to an aromatic ring indicates that Ra, X, and a carbon atom may be bonded to any position on the aromatic ring.
Dependencies are inferred from the claim text.