Curable composition
AssigneeLG Chem, Ltd.
InventorsJeong Hyun Lee, Do Yeon Kim, Yang Gu Kang, Shin Hee Jun, Ha Na Lee, Ho Yeon Son
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Abstract
The present application relates to a resin composition or a use thereof. In the present application, it is possible to provide a resin composition or a cured body thereof that exhibits low adhesion force to a predetermined adherend while exhibiting high thermal conductivity. Also, in the present application, the low adhesion force can be achieved without using an adhesion force adjusting component such as a plasticizer or in a state where the use ratio thereof is minimized. The present application can also provide a product comprising the curable composition or the cured body thereof.
Claims15
A curable composition comprising a polyol compound and a filler,
- wherein the polyol compound comprises at least one substituent of Formula 1 at its terminal:
- wherein in Formula 1, R is a branched alkyl group having 5 or more carbon atoms, a branched alkenyl group having 5 or more carbon atoms, or a branched alkynyl group having 5 or more carbon atoms.
A two-component composition comprising:
- a main part comprising a polyol compound and a filler;
- and
- a curing agent part comprising a curing agent component and a filler,
- wherein the polyol compound comprises at least one substituent of Formula 1 at its terminal:
- wherein in Formula 1, R is a branched alkyl group having 5 or more carbon atoms, a branched alkenyl group having 5 or more carbon atoms, or a branched alkynyl group having 5 or more carbon atoms.
Dependencies are inferred from the claim text.