Manufacturing method of an oxide semiconductor device
AssigneeJapan Display Inc.
InventorYohei Yamaguchi
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AssigneeJapan Display Inc.
InventorYohei Yamaguchi
Estimating the term…
The purpose of the present invention is to improve reliability of the TFT of the oxide semiconductor. The feature of the invention is: A display device comprising: a substrate including a display area where plural pixels are formed, the pixel includes a first TFT of a first oxide semiconductor, a first gate insulating film is formed under the first oxide semiconductor, a first gate electrode is formed under the first gate insulating film, an interlayer insulating film is formed on the first oxide semiconductor; a drain wiring, which connects with the first oxide semiconductor, and a source wiring, which connects with the first oxide semiconductor, are formed on the interlayer insulating film; the drain wiring or the source wiring is a laminated structure of a second oxide semiconductor and a first metal, the second oxide semiconductor is under the first metal.
A manufacturing method of a semiconductor device comprising:
A manufacturing method of a semiconductor device comprising:
Dependencies are inferred from the claim text.