Method for splitting semiconductor wafers
AssigneeInfineon Technologies AG
InventorsChristian Beyer, Francisco Javier Santos Rodriguez, Hans-Joachim Schulze, Marko David Swoboda
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Abstract
A method of splitting off a semiconductor wafer from a semiconductor bottle includes: forming a separation region within the semiconductor boule, the separation region having at least one altered physical property which increases thermo-mechanical stress within the separation region relative to the remainder of the semiconductor boule; and applying an external force to the semiconductor boule such that at least one crack propagates along the separation region and a wafer splits from the semiconductor boule.
Claims15
A method of splitting off a semiconductor wafer from a semiconductor boule, the method comprising:
- forming a separation region within the semiconductor boule, the separation region having at least one altered physical property which increases thermo-mechanical stress within the separation region relative to the remainder of the semiconductor boule;
- and
- applying an external force to the semiconductor boule such that at least one crack propagates along the separation region and a wafer splits from the semiconductor boule,
- wherein applying the external force to the semiconductor boule comprises:
- applying a polymer to the semiconductor boule, the polymer having a CTE (coefficient of thermal expansion) different from a CTE of the semiconductor boule;
- and
- subjecting the polymer and the semiconductor boule to a temperature process during which the polymer imparts mechanical stress to the semiconductor boule.
Dependencies are inferred from the claim text.