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US 12,356,544 B2Granted
Composites for high-frequency printed circuit boards and methods of making
AssigneeCorning Incorporated
InventorsDayue Jiang, Geraint Owen
Life of this patent
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Abstract
A composite includes at least one thermoplastic polymer; and at least one PTFE-based polymer, such that the composite has a dielectric loss tangent of less than 10−3. Moreover, a method for preparing a composite includes mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture; melting the mixture to form a composite material; and hot pressing the composite material to form a composite sheet.
Claims17
A composite, comprising:
- at least one thermoplastic polymer;
- and
- at least one PTFE-based polymer,
- wherein the composite has a dielectric loss tangent of less than 10−3 at a frequency of 10 GigaHertz, and
- wherein the at least one thermoplastic polymer comprises at least one of:
2 more elements
A method for preparing a composite, comprising:
- mixing at least one thermoplastic polymer with at least one PTFE-based polymer to form a homogenous mixture;
- melting the mixture to form a composite material;
- and
- hot pressing the composite material to form a composite sheet,
- wherein the at least one thermoplastic polymer comprises at least one of:
2 more elements
Dependencies are inferred from the claim text.