Inductor device wiring architecture, integrated circuit, and communications device
AssigneeHuawei Technologies Co., Ltd.
InventorHui Ye
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Abstract
Embodiments of this application disclose an inductor device wiring architecture, including an inductor device and a plurality of dummy metals located under the inductor device. The plurality of dummy metals are arranged in a plurality of metal layers. Each of the plurality of metal layers corresponds to some of the plurality of dummy metals. Arrangement areas of dummy metals corresponding to at least two of the plurality of metal layers progressively increase in a direction away from the inductor device. In the inductor device wiring architecture, adverse effects on performance of the inductor device can be reduced, and a product yield can be increased. The embodiments of this application further disclose an integrated circuit and a communications device.
Claims13
An inductor device wiring architecture, comprising:
- an inductor device;
- and
- a plurality of dummy metals located under the inductor device, the plurality of dummy metals are arranged in a plurality of metal layers, each metal layer of the plurality of metal layers corresponds to one or more dummy metals of the plurality of dummy metals, and arrangement areas of dummy metals corresponding to at least three of the plurality of metal layers progressively increase in a direction away from the inductor device.
An integrated circuit, comprising an inductor device wiring architecture, comprising:
- an inductor device;
- and
- a plurality of dummy metals located under the inductor device, the plurality of dummy metals are arranged in a plurality of metal layers, each metal layer of the plurality of metal layers corresponds to one or more dummy metals of the plurality of dummy metals, and arrangement areas of dummy metals corresponding to at least three of the plurality of metal layers progressively increase in a direction away from the inductor device.
A communications device, comprising a radio frequency integrated circuit, comprising:
- an inductor device;
- and
- a plurality of dummy metals located under the inductor device, the plurality of dummy metals are arranged in a plurality of metal layers, each metal layer of the plurality of metal layers corresponds to one or more dummy metals of the plurality of dummy metals, and arrangement areas of dummy metals corresponding to at least three of the plurality of metal layers progressively increase in a direction away from the inductor device.
Dependencies are inferred from the claim text.