Element forming wafer and method for manufacturing the same

An element forming wafer, comprising:

• a semiconductor wafer having a plurality of chip forming regions;
• and
• a thin layer formed on the semiconductor wafer, wherein
• a plurality of portions of the thin layer each of which forms an element in each of the plurality of chip forming portions are defined as a plurality of element forming portions,
• a plurality of regions are formed in the thin layer in one direction that passes through a center of the semiconductor wafer and that extends along an in-plane direction of the semiconductor wafer,
• each of the plurality of element forming portions is arranged in a respective one of the plurality of regions,
• a stress distribution that is along the one direction and is generated across the plurality of element forming portions has a maximum and a minimum of the stress in each of the plurality of regions, and
• a rate of change in the stress between the maximum and the minimum in each of the plurality of regions is smaller than a rate of change in the stress at a boundary between adjacent ones of the plurality of regions.