Workpiece support for a thermal processing system
AssigneesBeijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
InventorsManuel Sohn, Rolf Bremensdorfer, Dieter Hezler
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AssigneesBeijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
InventorsManuel Sohn, Rolf Bremensdorfer, Dieter Hezler
Estimating the term…
A workpiece support for a thermal processing system is provided. The workpiece support includes a rotor configured to support a workpiece. The workpiece support further includes a gas supply. The gas supply can include a plurality of bearing pads. Each of the bearing pads can be positioned closer to a periphery of the rotor than a center of the rotor. Each of the bearing define one or more passages configured to direct gas onto the rotor to control a position of the rotor along a first axis and a second axis that is substantially perpendicular to the first axis. Furthermore, one or more of the bearing pads define at least one additional passage configured to direct gas onto the rotor to control rotation of the rotor about the first axis.
A workpiece support for a thermal processing system, the workpiece support comprising:
A thermal processing system comprising:
Dependencies are inferred from the claim text.