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US 12,351,511 B2Granted
Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate
AssigneesiSABers Japan Co. Ltd., Tadatomo SUGA
InventorsTadatomo Suga, Yoshiie Matsumoto
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Abstract
Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.
Claims20
A method of bonding substrates, each substrate having a bonding surface, the method comprising:
- irradiating both or at least one of the bonding surfaces of a pair of substrates with energy particles which are a mixed gas comprising an inert gas and oxygen, the mixed gas having a flow rate ratio of O2/(Ar+O2) in a range of from 3.75 to 8.75%, before forming a thin film on both or at least one of the bonding surfaces;
- forming a thin film of a metal oxide on both or at least one of the irradiated bonding surfaces of the pair of substrates at least one of which is a transparent substrate, comprising forming the thin film by sputtering the metal oxide as a target and a mixed gas comprising an inert gas and oxygen;
- and
- contacting the bonding surfaces of the bonding substrates with each other via the thin film of the metal oxide.
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A method of bonding a first substrate having a first bonding surface and a second substrate having a second bonding surface, the method comprising:
- irradiating the first and/or second bonding surface with energy particles of a mixed gas comprising an inert gas and oxygen;
- forming a thin film of a metal oxide directly on the first and/or second bonding surface irradiated via atomic layer deposition or via sputtering a metal as a target and a mixed gas comprising an inert gas and oxygen;
- and
- contacting the first and second bonding surfaces of the substrates with each other via the thin film of the metal oxide.
1 more element
Dependencies are inferred from the claim text.