Substrate processing apparatus

An apparatus for buff-processing a processing target object, comprising:

• a buff table that includes a support surface for supporting the processing target object;
• a nozzle for supplying the support surface with a chemical solution for cleaning the support surface of the buff table;
• and
• a buff head to which a buff pad for buff-processing the processing target object through physical contact is attached, wherein a cleaning member including a brush or a sponge member for cleaning the support surface of the buff table through physical contact is attached to the buff head, wherein the buff pad attached to the buff head and the cleaning member attached to the buff head are configured to independently ascend and descend relative to each other, and wherein the cleaning member protrudes with respect to the buff pad when cleaning the support surface of the buff table;
• wherein the buff table includes a fluid passage that extends to the support surface and is for supplying a fluid to the support surface through the buff table while the support surface of the buff table is cleaned,
• wherein the fluid passage is connected to a pure water and/or chemical solution supply source, and
• wherein the fluid passage is configured to be communicable with a vacuum source for causing the processing target object to be vacuum-sucked onto the support surface while the processing target object is buff-processed.