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US 12,350,109 B2Granted
Ultrasound probe
AssigneeFUJIFILM Corporation
InventorsTakayuki Iwashita, Hiroshi Hattori, Tomohiro Shiraishi, Hidetsugu Katsura, Wataru Sawada, Sachio Shimada
Life of this patent
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Abstract
Behind an electronic circuit, a thermally anisotropic main backing is provided. The main backing has two outer surfaces (low thermal conductivity surfaces) perpendicular to an X direction. In a first gap located adjacent to one of the outer surfaces, an FPC and a first group of electric components are arranged. In a second gap located adjacent to the other one of the outer surfaces, the FPC and a second group of electric components are arranged.
Claims18
An ultrasound probe, comprising:
- a transducer array;
- an electronic circuit provided behind the transducer array and electrically connected to the transducer array;
- a sheet-shaped wiring member electrically connected to the electronic circuit;
- a backing provided behind the electronic circuit and configured to attenuate ultrasound waves from the transducer array;
- and
- a heat absorbing member configured to absorb heat from the backing,
- wherein assuming that a direction in which the transducer array, the electronic circuit, and the backing are arranged is defined as a Z direction, a direction perpendicular to the Z direction is defined as an X direction, and a direction perpendicular to the Z direction and the X direction is defined as a Y direction,
- in the backing, both of Z-direction thermal conductivity and Y-direction thermal conductivity are higher than X-direction thermal conductivity,
- the backing has two outer surfaces intersecting the X direction and bordering a first gap and a second gap, and
- the wiring member extends through the first gap and the second gap.
7 more elements
Dependencies are inferred from the claim text.