Electrode arrangement for an electronic tag

A capacitive coupled radio frequency identification, RFID, tag comprising:

• a semiconductor substrate having a first planar surface and a second planar surface distal from the first planar surface;
• a metallic pad formed on the first planar surface of the semiconductor substrate;
• a circuit formed on the semiconductor substrate and electrically connected to the metallic pad and the second planar surface of the semiconductor substrate, the circuit configured to respond to a radio frequency, RF, input signal by providing a data signal encoded by varying an impedance between the metallic pad and the second planar surface of the semiconductor substrate, wherein the metallic pad formed on the first planar surface extends beyond the semiconductor substrate;
• wherein the metallic pad is rectangular, elongate or T-shaped, and/or the capacitive coupled RFID tag further comprises a metal electrode in electrical contact with the second planar surface,
• wherein a portion of the metallic pad and/or metal electrode is curved to conform to a curved surface to which the capacitive coupled RFID tag is to be attached.