Thermal diode and thermal switch bi-directional heat transfer in building envelopes

A device for performing thermal management, the device comprising:

• a first conductor in direct thermal contact with a heat source;
• a second conductor in direct thermal contact with a heat sink;
• an insulator positioned between the first conductor and the second conductor and having a length;
• a connector extending greater than the length;
• and
• a piston configured to move the connector;
• wherein;
• the connector is configured to move between a first position and a second position,
• in the first position the connector being in thermal contact with the second conductor and the insulator,
• in the second position the connector being in thermal contact with the first conductor and the second conductor, and
• at a first temperature the piston is configured to move the connector from the first position to the second position;
• and
• when in the second position the device is configured to allow heat to flow from the heat source to the heat sink.