Microelectromechanical infrared sensing device and fabrication method thereof
AssigneeIndustrial Technology Research Institute
InventorsChin-Jou Kuo, Bor-Shiun Lee, Ming-Fa Chen
Life of this patent
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Abstract
A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.
Claims20
A microelectromechanical (MEMS) infrared sensing device, comprising a substrate and an infrared sensing component provided above the substrate, and the infrared sensing component comprising:
- a sensing plate, comprising at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements, wherein the sensing plate has a plurality of openings, the metallic elements respectively surround the openings, the sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another parallel to the substrate;
- and
- at least one supporting element connecting the sensing plate with the substrate.
A method for fabricating MEMS infrared sensing device, comprising:
- forming a sacrificial layer on a substrate;
- forming at least one supporting element in the sacrificial layer;
- forming a sensing plate on the sacrificial layer, wherein the sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements, the sensing electrode is connected with the infrared sensing layer and the at least one supporting element, and the metallic elements are spaced apart from one another parallel to the substrate;
- forming a plurality of openings in the sensing plate, wherein the openings penetrate the metallic elements respectively;
- and
- removing the sacrificial layer.
Dependencies are inferred from the claim text.