Composite molded component
AssigneeSumitomo Wiring Systems, Ltd.
InventorsHironobu Yamamoto, Kyungwoo Kim, Toshinari Kobayashi, Yukitoshi Terasaka
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AssigneeSumitomo Wiring Systems, Ltd.
InventorsHironobu Yamamoto, Kyungwoo Kim, Toshinari Kobayashi, Yukitoshi Terasaka
Estimating the term…
The object of the present disclosure is to minimize a number of positioning pins used to position an inner molded portion when an outer molded portion is molded around the inner molded portion. The present disclosure provides a composite molded component including an inner molded portion and an outer molded portion that covers the inner molded portion. An anti-rotation detent hole, which is open at a surface of the inner molded portion, is formed in the inner molded portion, a through hole that extends from a surface of the outer molded portion to the anti-rotation detent hole is formed in the outer molded portion, the anti-rotation detent hole is a hole that is delimited by an inner peripheral surface and a bottom surface, and at least part of the inner peripheral surface is formed in a non-circular shape.
A composite molded component comprising:
Dependencies are inferred from the claim text.