Cooling device for heat treatment
AssigneeDongwoo Hst Co., Ltd.
InventorsSoo Jin Chung, Won Ki Chung, Jun Yong Park, Young Min Shin, Hyeon Seung Lee
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AssigneeDongwoo Hst Co., Ltd.
InventorsSoo Jin Chung, Won Ki Chung, Jun Yong Park, Young Min Shin, Hyeon Seung Lee
Estimating the term…
The present disclosure relates to a cooling device for heat treatment that performs heat treatment by cooling individually or as a whole a heated metal object. The cooling device for heat treatment includes: a chamber to which a plurality of objects is charged through one open side thereof; an individual cooling unit configured to be provided in the chamber, to individually cover the object, and to spray a cooling medium onto the object; and a driving unit configured to be provided on the chamber and to move the individual cooling unit in an up and down direction. With this configuration, it is possible to obtain a required cooling capacity by cooling individually or as a whole a heated metal object.
A cooling device for heat treatment, the cooling device comprising:
Dependencies are inferred from the claim text.