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US 12,343,979 B2Granted
Device and method of manufacturing the device
AssigneeCanon Kabushiki Kaisha
InventorsNoriyuki Nakai, Takamitsu Hoshihira
Life of this patent
Estimating the term…
Abstract
A device includes a first member, a second member, and a bonding layer. A first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer. The bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive. A distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer.
Claims14
A device comprising:
- a first member;
- a second member;
- and
- a bonding layer,
- wherein a first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer,
- wherein the bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive, and
- wherein a distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer,
- wherein the first member and/or the second member includes a convex portion formed along the at least one portion of the outer edge and projecting in a direction in which the distance between the first surface and the second surface is decreased, and
- wherein the convex portion includes a surface inclined such that a thickness of the bonding layer increases at the at least one portion of the outer edge in a direction extending toward an edge surface.
6 more elements
A device comprising:
- a first member;
- a second member;
- and
- a bonding layer,
- wherein a first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer,
- wherein the bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive,
- wherein a distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer, and
- wherein a content of the filler particle in the bonding layer is 0.2 mass % to 1.0 mass %.
5 more elements
A device comprising:
- a first member;
- a second member;
- and
- a bonding layer,
- wherein a first surface of the first member and a second surface of the second member are bonded to each other via the bonding layer,
- wherein the bonding layer includes a filler particle configured to be in contact with both of the first surface and the second surface, and a solidified adhesive,
- wherein a distance between the first surface and the second surface is smaller than a diameter of the filler particle at at least one portion of an outer edge of the bonding layer, and
- wherein a base material of the first member and the second member is silicon.
5 more elements
Dependencies are inferred from the claim text.