Process for forming a laminate
AssigneeArkema France
InventorsRui Xie, Jie Wu
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a process for forming a laminate. The process includes (A) uniformly applying an isocyanate component to a first substrate, the isocyanate component containing an isocyanate compound; (B) uniformly applying an isocyanate-reactive component to a second substrate, the isocyanate-reactive component containing an amine-terminated compound; (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate; (D) curing the adhesive composition to bond the first substrate and the second substrate; and (E) forming the laminate.
Claims13
A process for forming a laminate comprising:
- (A) uniformly applying an isocyanate component at a viscosity at 25° C. from 5,000 cP to 20,000 cP to a first substrate, the isocyanate component comprising an isocyanate compound;
- (B) uniformly applying an isocyanate-reactive component at a viscosity at 25° C. from 1,000 cP to 20,000 cP to a second substrate, the isocyanate-reactive component comprising
- (i) from 60 wt % to 90 wt % of a diamine-terminated polyether having the structure (A)
- wherein n=1-30,
- (ii) from 40 wt % to 10 wt % of a polyol component consisting of
- (a) a phosphate ester polyol, and
- (b) an optional polyether polyol, wherein weight percent is based on total weight of (B) and (B) (i) and (B) (ii) amount to 100 wt % of the isocyanate-reactive component (B);
- (C) bringing the first substrate and the second substrate together, thereby mixing and reacting the isocyanate component and the isocyanate-reactive component to form an adhesive composition between the first substrate and the second substrate;
- (D) curing the adhesive composition to bond the first substrate and the second substrate wherein the isocyanate component and the isocyanate-reactive component amount to 100 wt % of the adhesive composition;
- and
- (E) forming the laminate.
A two-component solvent-less adhesive composition comprising:
- (A) an isocyanate component adapted for application to a first substrate, the isocyanate component comprising an isocyanate prepolymer;
- (B) an isocyanate-reactive component adapted for application to a second substrate, the isocyanate-reactive component comprising
- (i) from 60 wt % to 90 wt % of a diamine-terminated polyether having the structure (A)
- wherein n=1-30,
- (ii) from 40 wt % to 10 wt % of a polyol component consisting of
- (a) a phosphate ester polyol, and
- (b) an optional polyether polyol, wherein weight percent is based on total weight of (B) and (B) (i) and (B) (ii) amount to 100 wt % of the isocyanate-reactive component (B);
- the two-component solvent-less adhesive composition having Isocyanate:
- Isocyanate-Reactive Stoichiometric Ratio from 1.0 to 5.0;
- and,
- wherein the isocyanate component and the isocyanate-reactive component amount to 100 wt % of the adhesive composition.
A laminate comprising:
- a first substrate;
- a second substrate;
- a solvent-less adhesive layer between the first substrate and the second substrate, the solvent-less adhesive layer comprising
- (A) an isocyanate component comprising an isocyanate prepolymer;
- and
- (B) an isocyanate-reactive component comprising
- (i) from 60 wt % to 90 wt % of a diamine-terminated polyether having the structure (A)
- wherein n=1-30,
- (ii) from 40 wt % to 10 wt % of a polyol component consisting of
- (a) a phosphate ester polyol, and
- (b) an optional polyether polyol, wherein weight percent is based on total weight of (B) and (B) (i) and (B) (ii) amount to 100 wt % of the isocyanate-reactive component (B);
- and wherein the isocyanate component and the isocyanate-reactive component amount to 100 wt % of the solvent-less adhesive layer.
Dependencies are inferred from the claim text.