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US 12,343,684 B2Granted
Filter apparatus for semiconductor device fabrication process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChwen Yu, En Tian Lin, Chih-Chiang Tseng, Tzu-Sou Chuang
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Abstract
A filter device includes one or more filter membranes, and a filter housing enclosing the one or more filter membranes. Each of the filter membranes includes a base membrane and a plurality of through holes.
Claims20
A method of manufacturing a filter membrane, the method comprising:
- forming a sacrificial layer over a substrate;
- forming a plurality of pillars over the substrate by a lithography process using a photomask placed over and separated from the sacrificial layer, wherein the lithography process includes applying exposure light through the photomask and patterning the sacrificial layer to form the plurality of pillars;
- forming a polymer layer over the substrate with the plurality of pillars;
- removing the plurality of pillars to form a plurality of through holes in the polymer layer;
- and
- detaching the polymer layer with the plurality of through holes from the substrate.
3 more elements
A method of manufacturing a filter membrane, the method comprising:
- forming a sacrificial layer over a substrate;
- forming a plurality of pillars by a lithography process using a photomask placed over and separated from the sacrificial layer, wherein the lithography process includes applying exposure light through the photomask and patterning the sacrificial layer to form the plurality of pillars;
- forming a polymer layer over the substrate with the plurality of pillars;
- removing the plurality of pillars to form a plurality of through holes in the polymer layer;
- and
- detaching the polymer layer with the plurality of through holes from the substrate.
3 more elements
A method of manufacturing a filter membrane, the method comprising:
- forming a sacrificial layer over a substrate;
- forming a plurality of pillars over the substrate by a lithography process using a photomask placed over and separated from the sacrificial layer, wherein the lithography process includes applying exposure light through the photomask and patterning the sacrificial layer to form the plurality of pillars;
- forming a polymer layer over the substrate with the plurality of pillars such that a thickness of the polymer layer is smaller than a height of the plurality of pillars;
- removing the plurality of pillars to form a plurality of through holes in the polymer layer;
- and
- detaching the polymer layer with the plurality of through holes from the substrate.
3 more elements
Dependencies are inferred from the claim text.