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US 12,342,113 B2Granted
Microphone apparatus
AssigneeNokia Technologies Oy
InventorsIan Davis, Oliver Burns, Diarmuid O'Connell, Akshat Agarwal, Nicholas Jeffers
Life of this patent
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Abstract
A microphone apparatus including: a casing; a composite material located within the casing, the composite material including at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted by an acoustic wave, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.
Claims20
A microphone apparatus, comprising:
- a casing;
- and
- a composite material located within the casing, the composite material comprising at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted with an acoustic wave through the casing, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.
A method for a microphone apparatus comprising:
- providing a casing;
- and
- providing a composite material located within the casing, the composite material comprising at least in part conductive particles, the composite material configured to alter an internal impedance based on a surface disturbance transmitted with an acoustic wave through the casing, and wherein the microphone apparatus is configured to be coupled to a surface that transmitted the acoustic wave.
Dependencies are inferred from the claim text.